Micron Laser Technology specializes in PCB laser processing and services for many of the largest international PCB manufacturers and contract assembly. For more than 20 years, MLT has perfected laser processes and techniques that have advanced PCB manufacturers industry-wide.

Our PCB laser processes our customized for both rigid (PCB) and flexible circuit (FPC) applications. Most every possible PCB material stack-up has a laser parameter set or recipe maintained in a material database for quick setup and delivery.

Micron Laser Technology is experienced with all conventional dielectrics and chemistries used in rigid multilayer PCBs, FPCs, rigid-flex printed circuits, ceramics, and high-frequency materials. These may include Kapton™, polyimide, FR4, Isola, Getek, Nelco, Hitachi, Rogers, Gore, RCC, LCP, ceramics, speedboard, Teflon, Mylar, Duroid, acrylics, Ultralam, PEEK, PTFE, and FEP to name a few. For a more detailed listing of laser compatible materials used in PCB manufacturing, click PCB Materials. To view Rigid and Flex PCB Laser Services brochure, click PCB Laser Services Brochure.

MICRON LASER PCB Process Advantage

• Microvia Vision Inspection
• Advanced uVia Diameters Less than 25um
• IPC Standards High Density Interconnect Types
• Via Trax ™ Technology for Target Pad Surface Texturing
• Lot/Panel Scale Reporting and Analysis for Drill Optimization
• Large Via Process Technology that Inhibits Target Pad Delamination
• Alignment and Scale Methodologies for Minimal Annular Ring Requirements